1 july 1997 ha-2529/883 uncompensated, high slew rate high output current, operational ampli?r features this circuit is processed in accordance to mil-std-883 and is fully conformant under the provisions of para- graph 1.2.1. high slew rate . . . . . . . . . . . . . . . . . . . . . 135v/ s (min) 150v/ s (typ) high output current . . . . . . . . . . . . . . . . . 30ma (min) high gain-bandwidth product . . . . . . . . . 15mhz (min) 20mhz(typ) wide power bandwidth . . . . . . . . . . . . . . . 2.1mhz (min) high input impedance . . . . . . . . . . . . . . . . . 50m ? (min) 130m ? (typ) low offset current . . . . . . . . . . . . . . . . . . . 25na (max) 5na (typ) fast settling (10v step to 0.1%) . . . . . . . . . . . 200ns (typ) low quiescent supply current . . . . . . . . . . 6ma (max) applications data acquisition systems rf ampli?rs video ampli?rs signal generators pulse ampli?ation description the ha-2529/883 is a monolithic operational ampli?r which typi?s excellence of design. with a design based on years of experience coupled with the reliable dielectric isolation process, these ampli?rs provide an outstanding combina- tion of dc and ac parameters at closed loop gains of 3 or greater without external compensation. the ha-2529/883 offers 135v/ s (min) slew rate and fast settling time (200ns typ), while consuming a mere 6ma (max) quiescent supply current, making these ampli?rs ideal components for video circuitry and data acquisition designs. with 15mhz minimum gain-bandwidth product combined with 7.5kv/v minimum open loop gain, the ha-2529/883 is an ideal component for demanding signal conditioning designs. these devices provide 30ma (min) output current drive with an output voltage swing of 10v (min), making then suited for pulse ampli?r and rf ampli- ?r components. ha-2529/883 will upgrade a system pres- ently using the ha-2520/22/883 or eha-2520/22/883 in regards to output current, slew rate, offset voltage drift, and offset current drift. to insure compliance with slew rate and transient response speci?ations, all devices are 100% tested for ac performance characteristics over full temperature. pinouts ordering information part number temp. range ( o c) package pkg. no. ha2-2529/883 -55 to 125 8 pin metal can t8.c ha7-2529/883 -55 to 125 8 ld cerdip f8.3a ha-2529/883 (cerdip) top view ha-2529/883 (metal can) top view 1 2 3 4 8 7 6 5 comp v+ out bal bal -in +in v- + - 2 4 6 1 3 7 5 8 comp out -in v- bal +in v+ bal + - spec number 511025-883 file number 3736.1 caution: these devices are sensitive to electrostatic discharge; follow proper ic handling procedures. 1-888-intersil or 321-724-7143 | copyright ?intersil corporation 1999
2 absolute maximum ratings t a =25 o c thermal information voltage between v+ and v- terminals . . . . . . . . . . . . . . . . . . . . 40v differential input voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15v voltage at either input terminal . . . . . . . . . . . . . . . . . . . . . . v+ to v- peak output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50ma esd rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <2000v operating conditions temperature range . . . . . . . . . . . . . . . . . . . . . . . . . -55 o c to 125 o c supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15v v incm 1/2 (v+ - v-) r l 500 ? thermal resistance (typical, note 1) ja jc cerdip package . . . . . . . . . . . . . . . . 115 o c/w 28 o c/w metal can package . . . . . . . . . . . . . . . 160 o c/w 75 o c/w package power dissipation limit at 75 o c for t j 175 o c cerdip package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 870mw metal can package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625mw package power dissipation derating factor above 75 o c cerdip package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.7mw/ o c metal can package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3mw/ o c maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . 175 o c maximum storage temperature range . . . . . . . . . .-65 o c to 150 o c maximum lead temperature (soldering 10s) . . . . . . . . . . . . . 300 o c caution: stresses above those listed in ?bsolute maximum ratings?may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?ation is not im plied. note: 1. ja is measured with the component mounted on an evaluation pc board in free air. table 1. dc electrical performance characteristics device tested at: v supply = 15v, r source = 100 ? , r load = 500k ? , v out = 0v, unless otherwise speci?d. parameter symbol conditions group a subgroups temp. ( o c) min max units input offset voltage v io v cm = 0v 1 25 -5 5 mv 2, 3 125, -55 -8 8 mv input bias current +i b v cm = 0v, +r s = 100k ? , -r s = 100 ? 1 25 -200 200 na 2, 3 125, -55 -400 400 na -i b v cm = 0v, +r s = 100 ? , -r s = 100k ? 1 25 -200 200 na 2, 3 125, -55 -400 400 na input offset current i io v cm = 0v, +r s = 100k ? , -r s = 100k ? 1 25 -25 25 na 2, 3 125, -55 -50 50 na common mode range +cmr v+ = 5v, v- = -25v 1 25 +10 - v 2, 3 125, -55 +10 - v -cmr v+ = 25v, v- = -5v 1 25 - -10 v 2, 3 125, -55 - -10 v large signal voltage gain +a vol v out = 0v and +10v, r l = 2k ? 4 25 10 - kv/v 5, 6 125, -55 7.5 - kv/v -a vol v out = 0v and -10v, r l = 2k ? 4 25 10 - kv/v 5, 6 125, -55 7.5 - kv/v common mode rejection ratio +cmrr ? v cm = +10v, v+ = +5v, v- = -25v, v out = -10v 12583-db 2, 3 125, -55 80 - db -cmrr ? v cm = -10v, v+ = +25v, v- = -5v, v out = +10v 12583-db 2, 3 125, -55 80 - db output voltage swing +v out r l = 2k ? 42510-v 5, 6 125, -55 10 - v -v out r l = 2k ? 4 25 - -10 v 5, 6 125, -55 - -10 v ha-2529/883 spec number 511025-883
3 output current +i out v out = -10v 4 25 30 - ma 5, 6 125, -55 20 - ma -i out v out = +10v 4 25 - -30 ma 5, 6 125, -55 - -20 ma quiescent power supply current +i cc v out = 0v, i out = 0ma 1 25 - 6 ma 2, 3 125, -55 - 7 ma -i cc v out = 0v, i out = 0ma 1 25 -6 - ma 2, 3 125, -55 -7 - ma power supply rejection ratio +psrr ? v sup = 10v, v+ = +20v, v- = -15v, v+ = +10v, v- = -15v 12580-db 2, 3 125, -55 80 - db -psrr ? v sup = 10v, v+ = +15v, v- = -20v, v+ = +15v, v- = -10v 12580-db 2, 3 125, -55 80 - db offset voltage adjustment +v io adj note 2 1 25 v io -1 - mv 2, 3 125, -55 v io -1 - mv -v io adj note 2 1 25 v io +1 - mv 2, 3 125, -55 v io +1 - mv note: 2. offset adjustment range is [v io (measured) 1mv] minimum referred to output. this test is for functionality only to assure adjustment through 0v. table 2. ac electrical performance characteristics device tested at: v supply = 15v, r source = 50 ? , r load = 2k ? , c load = 50pf, a vcl = +3v/v, unless otherwise speci?d. parameters symbol conditions group a subgroups temp. ( o c) min max units slew rate +sr v out = -5v to +5v 25% +sr 75% 7 25 135 - v/ s 8a, 8b 125, -55 125 - v/ s -sr v out = +5v to -5v 75% -sr 25% 7 25 135 - v/ s 8a, 8b 125, -55 125 - v/ s rise and fall time t r v out = 0 to +200mv 10% t r 90% 7 25 - 45 ns 8a, 8b 125, -55 - 50 ns t f v out = 0 to -200mv 10% t f 90% 7 25 - 45 ns 8a, 8b 125, -55 - 50 ns overshoot +os v out = 0 to +200mv 7 25 - 40 % 8a, 8b 125, -55 - 40 % -os v out = 0 to -200mv 7 25 - 40 % 8a, 8b 125, -55 - 40 % table 1. dc electrical performance characteristics (continued) device tested at: v supply = 15v, r source = 100 ? , r load = 500k ? , v out = 0v, unless otherwise speci?d. parameter symbol conditions group a subgroups temp. ( o c) min max units ha-2529/883 spec number 511025-883
4 spec number 511025-883 table 3. electrical performance characteristics device characterized at: v supply = 15v, r load = 2k ? , c load = 50pf, c comp = 0pf, unless otherwise speci?d. parameters symbol conditions notes temp. ( o c) min max units differential input resistance r in v cm = 0v 3 25 50 - m ? gain power bandwidth gbwp v o = 200mv, f o 10khz 3 25 15 - mhz full power bandwidth fpbw v peak = 10v 3, 4 25 2.1 - mhz minimum closed loop stable gain clsg r l = 2k ? , c l = 50pf 3 -55 to 125 3 - v/v output resistance r out open loop 3 25 - 60 ? power consumption pc v out = 0v, i out = 0ma 3, 5 -55 to 125 - 210 mw notes: 3. parameters listed in table 3 are controlled via design or process parameters and are not directly tested at final production. these param- eters are lab characterized upon initial design release, or upon design changes. these parameters are guaranteed by characteriz ation based upon data from multiple production runs which reflect lot to lot and within lot variation. 4. full power bandwidth guarantee based on slew rate measurement using fpbw = slew rate/(2 v peak ). 5. quiescent power consumption based upon quiescent supply current test maximum. (no load on outputs.) table 4. electrical test requirements mil-std-883 test requirements subgroups (see tables 1 and 2) interim electrical parameters (pre burn-in) 1 final electrical test parameters 1 (note 6), 2, 3, 4, 5, 6, 7, 8a, 8b group a test requirements 1, 2, 3, 4, 5, 6, 7, 8a, 8b groups c and d endpoints 1 note: 6. pda applies to subgroup 1 only. ha-2529/883
5 spec number 511025-883 die characteristics die dimensions: 67 mils x 57 mils x 19 mils 1700 m x 1440 m x 483 m metallization: type: al, 1% cu thickness: 16k ? 2k ? glassivation: type: nitride (si3n4) over silox (sio2, 5% phos.) silox thickness: 12k? 2k? nitride thickness: 3.5k? 1.5k? worst case current density: 0.78 x 10 5 a/cm 2 substrate potential (powered up): unbiased transistor count: 40 process: bipolar dielectric isolation metallization mask layout ha-2529/883 comp v+ out bal bal -in +in v- ha-2529/883
6 test circuit (applies to tables 1 and 2) test circuits and waveforms figure 1. slew rate and settling time note: measured on both positive and negative transitions from 0v to +200mv and 0v to -200mv at the output. figure 2. transient response figure 3. simplified test circuit (applies to table 2) 100k 1 open 2 s 3a s 1 1 open 2 s 5a 1 2 100k 1 2 s 3b s 2 1 open 2 s 6 1 2 0.1 1 0.1 1 v ac 50 open v- 667 100 100 5k 50k 2 1 s 4 1.33k dut - + v+ s 5b 1 2 s 7 1 2 3 open 2 3 s 8 open 1 10k 2k 50pf (note) ac out note: includes stray capacitances s 9 open 1 2 v2 500k 50k -1/10 v 1 for loop stability, use min value capacitor to prevent oscillation buffer - + - + -1 x2 e out all resistors = 1% ( ? ) all capacitors = 10% ( f) +1.67v input +5v 90% output 10% error band 10mv from final value ? t slew = ? v/ ? t -1.67v ? v -5v rate settling time input 90% output 10% 0mv rise time 67mv 0v +200mv overshoot 0 -67mv v out v in 1.33k ? 50pf 667 ? 50 ? + - ha-2529/883 spec number 511025-883
7 burn-in circuits ha7-2529/883 cerdip ha2-2529/883 metal can notes: r 1 = 1m ? , 5%, 1/4w (min) c 1 = c 2 = 0.01 f/socket (min) or 0.1 f/row (min) c 3 = 0.01 f/socket (10%) d 1 = d 2 = 1n4002 or equivalent/board |(v+) - (v-)| = 30v v+ c 1 d 1 r 1 d 2 c 2 v- + - 1 3 4 8 7 6 5 2 c 3 1 5 8 + - v+ c 1 d 1 6 2 7 c 3 3 r 1 4 c 2 d 2 v-
8 ha-2529/883 spec number 511025-883 notes: 1. index area: a notch or a pin one identi?ation mark shall be locat- ed adjacent to pin one and shall be located within the shaded area shown. the manufacturer s identi?ation shall not be used as a pin one identi?ation mark. 2. the maximum limits of lead dimensions b and c or m shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. dimensions b1 and c1 apply to lead base metal only. dimension m applies to lead plating and finish thickness. 4. corner leads (1, n, n/2, and n/2+1) may be configured with a partial lead paddle. for this configuration dimension b3 replaces dimension b2. 5. this dimension allows for off-center lid, meniscus, and glass overrun. 6. dimension q shall be measured from the seating plane to the base plane. 7. measure dimension s1 at all four corners. 8. n is the maximum number of terminal positions. 9. dimensioning and tolerancing per ansi y14.5m - 1982. 10. controlling dimension: inch. bbb c a - b s c q l a seating base d plane plane -d- -a- -c- -b- d e s1 b2 b a e m c1 b1 (c) (b) section a-a base lead finish metal e a/2 a m s s ccc c a - b m d s s aaa c a - b m d s s e a ceramic dual-in-line frit seal packages (cerdip) f8.3a mil-std-1835 gdip1-t8 (d-4, configuration a) 8 lead ceramic dual-in-line frit seal package symbol inches millimeters notes min max min max a - 0.200 - 5.08 - b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 d - 0.405 - 10.29 5 e 0.220 0.310 5.59 7.87 5 e 0.100 bsc 2.54 bsc - ea 0.300 bsc 7.62 bsc - ea/2 0.150 bsc 3.81 bsc - l 0.125 0.200 3.18 5.08 - q 0.015 0.060 0.38 1.52 6 s1 0.005 - 0.13 - 7 90 o 105 o 90 o 105 o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - m - 0.0015 - 0.038 2, 3 n8 88 rev. 0 4/94
9 all intersil semiconductor products are manufactured, assembled and tested under iso9000 quality systems certi?ation. intersil products are sold by description only. intersil corporation reserves the right to make changes in circuit design and/o r speci?ations at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of p atents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiaries. for information regarding intersil corporation and its products, see web site http://www.intersil.com sales of?e headquarters north america intersil corporation p. o. box 883, mail stop 53-204 melbourne, fl 32902 tel: (321) 724-7000 fax: (321) 724-7240 europe intersil sa mercure center 100, rue de la fusee 1130 brussels, belgium tel: (32) 2.724.2111 fax: (32) 2.724.22.05 asia intersil (taiwan) ltd. taiwan limited 7f-6, no. 101 fu hsing north road taipei, taiwan republic of china tel: (886) 2 2716 9310 fax: (886) 2 2715 3029 ha-2529/883 spec number 511025-883 metal can packages (can) notes: 1. (all leads) b applies between l1 and l2. b1 applies between l2 and 0.500 from the reference plane. diameter is uncontrolled in l1 and beyond 0.500 from the reference plane. 2. measured from maximum diameter of the product. 3. is the basic spacing from the centerline of the tab to terminal 1 and is the basic spacing of each lead or lead position (n -1 places) from , looking at the bottom of the package. 4. n is the maximum number of terminal positions. 5. dimensioning and tolerancing per ansi y14.5m - 1982. 6. controlling dimension: inch. b d2 e k1 k b1 base and seating plane f q d d1 l1 l2 reference plane l a b2 b1 base metal lead finish section a-a a a n e 1 c l 2 1 t8.c mil-std-1835 macy1-x8 (a1) 8 lead metal can package symbol inches millimeters notes min max min max a 0.165 0.185 4.19 4.70 - b 0.016 0.019 0.41 0.48 1 b1 0.016 0.021 0.41 0.53 1 b2 0.016 0.024 0.41 0.61 - d 0.335 0.375 8.51 9.40 - d1 0.305 0.335 7.75 8.51 - d2 0.110 0.160 2.79 4.06 - e 0.200 bsc 5.08 bsc - e1 0.100 bsc 2.54 bsc - f - 0.040 - 1.02 - k 0.027 0.034 0.69 0.86 - k1 0.027 0.045 0.69 1.14 2 l 0.500 0.750 12.70 19.05 1 l1 - 0.050 - 1.27 1 l2 0.250 - 6.35 - 1 q 0.010 0.045 0.25 1.14 - 45 o bsc 45 o bsc 3 45 o bsc 45 o bsc 3 n8 84 rev. 0 5/18/94
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